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MosChip Technologies Partners With EMASS for Ultra-Low-Power Edge AI SoC Development

Key Highlights

  • MosChip collaborates with EMASS on ECS-DoT Edge AI SoC development.
  • The SoC targets up to 93 percent faster processing performance.
  • Energy use reduced by up to 90 percent over conventional edge AI chips.
  • Supports 22nm silicon implementation including physical design and packaging.
  • Designed for wearables, drones, healthcare trackers and industrial IoT.

MosChip Technologies announced its collaboration with EMASS to support the silicon implementation of the ECS-DoT Edge AI System-on-Chip, an ultra-low-power chip designed for always-on intelligence across wearables, drones, industrial IoT systems, and edge sensors.

EMASS led the architecture design of the ECS-DoT SoC, targeting up to 93% faster processing and nearly 90% lower energy consumption than conventional edge AI solutions. MosChip contributed engineering support across 22nm silicon implementation, including physical design workflows, tape-out coordination, packaging, assembly, evaluation hardware, and validation activities.

The ECS-DoT SoC is based on a RISC-V architecture and integrates dual neural accelerators and 4MB of on-chip memory. It enables real-time, milliwatt-class inference for vision, audio, and sensor workloads without cloud dependency. Its compact, power-efficient design makes it suitable for wearables, healthcare devices, drones, and industrial monitoring systems.

Both companies noted that the partnership combines EMASS’s differentiated architecture with MosChip’s engineering expertise, resulting in a fully functional and robust SoC for OEM partners.

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